Compact microstrip directional coupler with topology layout on multilayer PCB

Larion O. Roman; Sergiy Ye. Martyniuk; Dmytro Vasylenko

doi:10.3103/S0735272722070032

Authors

Larion O. Roman National Technical University of Ukraine “Igor Sikorsky Kyiv Polytechnic Institute”, Ukraine https://orcid.org/0000-0003-4397-0077
Sergiy Ye. Martyniuk National Technical University of Ukraine “Igor Sikorsky Kyiv Polytechnic Institute”, Ukraine http://orcid.org/0000-0002-1920-8755
Dmytro Vasylenko National Technical University of Ukraine “Igor Sikorsky Kyiv Polytechnic Institute”, Ukraine https://orcid.org/0000-0002-2114-6629

DOI:

https://doi.org/10.3103/S0735272722070032

Keywords:

printed circuit board, PCB, directional coupler

Abstract

This paper presents a compact microstrip directional coupler (MDC) based on coupled lines; the multilayer topology of this coupler is optimized for operation in the L-band frequency range. A peculiarity of the proposed MDC design implies that the upper metallization of the multilayer package of printed circuit board (PCB) is used for signal conductors, while the interlayer transitions of the PCB are implemented in metallization of screen for increasing the working thickness of substrate in the region of location of coupled lines. The original synthesis technique for microstrip device topology that takes into account the impact of losses in metal on the characteristics and minimizes the required quantity of the intermediate test boards in practice.

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