DOI: https://doi.org/10.3103/S0735272715110047
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Model of thermal processes in structural-and-design module

Electrothermal models of structural elements of radioelectronic device

B. M. Uvarov, Yu. F. Zin'kovskii

Abstract


The paper considers basic features of thermal processes in structural modules of radioelectronic device (cell, microassembly) and elements of their electronic structure. The efficiency factors of modules and the indicators of energy performance of resistors, capacitors, and inductors were analyzed on the basis of models of equivalent two-pole networks. The mathematical model of microassembly thermal field was proposed and the analytical equation for determining temperatures of all its elements was derived.


Keywords


electronic device; cell; microassembly; model of two-pole network; thermal model; temperature of elements

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References


UVAROV, B.M.; ZIN'KOVSKII, Y.F. Optimization of Thermal Conditions and Reliability of Structural Designs of Electronic Hardware with Probabilistic Characteristics. Kyiv: Korniichuk, 2011 [in Ukrainian].

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Standard of Ukraine DSTU 2992-96. Electronic Devices. Reliability Calculation Methods (1996) [in Ukrainian].

PRYTKOV, S.F.; GORBACHEVA, V.M.; MARTYNOVA, M.N.; PETROV, G.A. Reliability of Electronic Components / Reference Book. MO RF & NII Elektronstandart, 2004 [in Russian].







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